Insulating thermally conductive resin composition

ABSTRACT

An insulating thermally conductive resin composition ( 1 ) includes a phase-separated structure including: a first resin phase ( 2 ) in which a first resin continues three-dimensionally; and a second resin phase ( 3 ) different from the first resin phase and formed of a second resin. Moreover, the insulating thermally conductive resin composition includes: small-diameter inorganic filler ( 4 ) unevenly distributed in the first resin phase; and large-diameter inorganic filler ( 5 ) that spans the first resin phase and the second resin phase and thermally connects pieces of the small-diameter inorganic filler, which is unevenly distributed in the first resin phase, to one another. Then, an average particle diameter of the small-diameter inorganic filler is 0.1 to 15 μm. Moreover, an average particle diameter of the large-diameter inorganic filler is larger than the average particle diameter of the small-diameter inorganic filler, and is 1 to 100 μm.

TECHNICAL FIELD

The present invention relates to an insulating thermally conductiveresin composition. More specifically, the present invention relates toan insulating thermally conductive resin composition for use in athermally conductive component that cools an electronic component andthe like, for example, for use in a radiator.

BACKGROUND ART

A semiconductor such as a computer (central processing unit: CPU), atransistor and a light emitting diode (LED) generates heat during usethereof, and performance of such an electronic component decreases owingto the heat in some case. Therefore, in usual, a radiator is mounted onsuch an electronic component that generates heat.

Heretofore, for such a radiator as described above, metal having highthermal conductivity has been used. Note that, in recent years, aninsulating thermally conductive resin composition, which has a highdegree of freedom in shape selection and is easy to reduce weight andminiaturize, has been going to be used. For the purpose of enhancing thethermal conductivity, the insulating thermally conductive resincomposition as described above must contain a large amount of athermally conductive inorganic filler in a binder resin. However, it isknown that a variety of problems occur if a blending amount of thethermally conductive inorganic filler is simply increased. For example,by increasing the blending amount of the thermally conductive inorganicfiller, viscosity of the resin composition that is not still cured isincreased, and moldability and workability thereof decrease to a largeextent, causing a molding failure. Moreover, an amount of such afillable inorganic filler has a limit, and accordingly, in many cases,the resin composition to be thus obtained does not have sufficientthermal conductivity (for example, refer to Patent Literatures 1 to 5).

Accordingly, there is disclosed a method for enhancing the thermalconductivity in such a manner that a bicontinuous phase-separatedstructure is formed by using a plurality of resins, and a thermallyconductive filler is unevenly distributed on one of resin phases or aresin interface to thereby form a thermal conduction path (for example,refer to Patent Literatures 6 and 7).

CITATION LIST Patent Literature

-   Patent Literature 1: Japanese Unexamined Patent Application    Publication No. S63-10616-   Patent Literature 2: Japanese Unexamined Patent Application    Publication No. H4-342719-   Patent Literature 3: Japanese Unexamined Patent Application    Publication No. H4-300914-   Patent Literature 4: Japanese Unexamined Patent Application    Publication No. H4-211422-   Patent Literature 5: Japanese Unexamined Patent Application    Publication No. H4-345640-   Patent Literature 6: Japanese Unexamined Patent Application    Publication No. 2010-65064-   Patent Literature 7: Japanese Unexamined Patent Application    Publication No. 2010-132894

SUMMARY OF INVENTION

However, if only the thermally conductive filler is unevenly distributedas in Patent Literatures 6 and 7, then it is apprehended that themoldability may be deteriorated since some filling amount is required toenhance the thermal conductivity. Moreover, it is difficult tocontinuously form the thermal conduction path, and the thermalconduction path is sometimes divided by the resin phases. Therefore,materials in Patent Literatures 6 and 7 still have had insufficientthermal conductivity.

The present invention has been made in consideration of such a problemas described above, which is inherent in the prior art. Then, it is anobject of the present invention to provide an insulating thermallyconductive resin composition, which is excellent in moldability whilehaving high thermal conductivity.

An insulating thermally conductive resin composition according to afirst aspect of the present invention includes a phase-separatedstructure including: a first resin phase in which a first resincontinues three-dimensionally; and a second resin phase different fromthe first resin phase and formed of a second resin. Moreover, theinsulating thermally conductive resin composition includes:small-diameter inorganic filler unevenly distributed in the first resinphase; and large-diameter inorganic filler that spans the first resinphase and the second resin phase and thermally connects pieces of thesmall-diameter inorganic filler, which is unevenly distributed in thefirst resin phase, to one another. An average particle diameter of thesmall-diameter inorganic filler is 0.1 to 15 μm. Moreover, an averageparticle diameter of the large-diameter inorganic filler is larger thanthe average particle diameter of the small-diameter inorganic filler,and is 1 to 100 μm.

An insulating thermally conductive resin composition according to asecond aspect of the present invention relates to the resin compositionaccording to the first aspect, wherein the small-diameter inorganicfiller is present on an interface between the first resin phase and thesecond resin phase.

An insulating thermally conductive resin composition according to athird aspect of the present invention relates to the resin compositionaccording to either one of the first and second aspects, wherein thesmall-diameter inorganic filler is brought into contact with theinterface between the first resin phase and the second resin phase, orspans the interface.

An insulating thermally conductive resin composition according to afourth aspect of the present invention relates to the resin compositionaccording to any one of the first to third aspects, wherein, in thefirst resin phase, thermal conduction paths are formed by bringing thepieces of the small-diameter inorganic filler in contact with oneanother.

An insulating thermally conductive resin composition according to afifth aspect of the present invention relates to the resin compositionaccording to any one of the first to fourth aspects, wherein a ratio ofa sum of the small-diameter inorganic filler and the large-diameterinorganic filler in the insulating thermally conductive resincomposition is 10 to 80% by volume. Moreover, a ratio of thelarge-diameter inorganic filler in the sum of the small-diameterinorganic filler and the large-diameter inorganic filler is 5 to 60% byvolume.

An insulating thermally conductive resin composition according to asixth aspect of the present invention relates to the resin compositionaccording to any one of the first to fifth aspects, wherein thesmall-diameter inorganic filler and the large-diameter inorganic fillercontain at least one selected from the group consisting of MgO, Al₂O₃,BN and AlN.

An insulating thermally conductive resin composition according to aseventh aspect of the present invention relates to the resin compositionaccording to any one of the first to sixth aspects, wherein the firstresin phase is formed of either one of a thermosetting resin and athermoplastic resin, and the second resin phase is formed of other ofthe thermosetting resin and the thermoplastic resin. Moreover, thethermosetting resin is an epoxy resin, and the thermoplastic resin ispolyether sulfone.

An insulating thermally conductive resin composition according to aneighth aspect of the present invention relates to the resin compositionaccording to the seventh aspect, wherein the phase-separated structureis a bicontinuous structure, and the small-diameter inorganic filler andthe large-diameter inorganic filler contain at least one of MgO, Al₂O₃and BN. Moreover, the ratio of the sum of the small-diameter inorganicfiller and the large-diameter inorganic filler in the insulatingthermally conductive resin composition is 20 to 80% by volume, andthermal conductivity of the insulating thermally conductive resincomposition is 3 W/m·K or more.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a schematic view showing an insulating thermally conductiveresin composition according to an embodiment of the present invention.

FIG. 2 is a schematic view showing a state of removing large-diameterinorganic filler from the insulating thermally conductive resincomposition according to the embodiment of the present invention.

FIGS. 3(a) to 3(d) are schematic views for explaining a phase-separatedstructure: FIG. 3(a) shows a sea-island structure; FIG. 3(b) shows acontinuously spherical structure; FIG. 3(c) shows a composite/dispersionstructure; and FIG. 3(d) shows a bicontinuous structure.

FIG. 4 is a scanning electron microscope picture showing a cross sectionof an insulating thermally conductive resin composition of Example 6.

FIG. 5 is a scanning electron microscope picture showing a cross sectionof an insulating thermally conductive resin composition of Example 7.

DESCRIPTION OF EMBODIMENTS

A description is made below of an insulating thermally conductive resincomposition according to an embodiment of the present invention. Notethat dimensional ratios of the drawings are exaggerated for convenienceof explanation, and are sometimes different from actual ratios.

As shown in FIG. 1, an insulating thermally conductive resin composition1 according to the embodiment of the present invention includes aphase-separated structure including: a first resin phase 2 in which afirst resin continues three-dimensionally; and a second resin phase 3,which is different from the first resin phase 2 and is formed of asecond resin. Moreover, in the first resin phase 2, small-diameterinorganic filler 4 with an average particle diameter of 0.1 μm to 15 μmis unevenly distributed. Then, the insulating thermally conductive resincomposition 1 contains large-diameter inorganic filler, which spans thefirst resin phase and the second resin phase, thermally and mutuallyconnects pieces of the small-diameter inorganic filler distributedunevenly in the first resin layer, and further, has an average particlediameter of 1 μm to 100 μm.

The insulating thermally conductive resin composition 1 of thisembodiment has a structure including the first resin phase 2 and thesecond resin phase 3, in which these resin phases are mixed with eachother, and are phase-separated from each other. Moreover, thesmall-diameter inorganic filler 4 is unevenly distributed in the firstresin phase 2, and the small-diameter inorganic filler 4 is brought intomutual and continuous contact. Therefore, thermal conduction paths 6 fortransferring thermal energy are formed in an inside of the first resinphase 2, and accordingly, thermal conductivity of the insulatingthermally conductive resin composition 1 can be enhanced.

Moreover, as shown in FIG. 1, the insulating thermally conductive resincomposition 1 includes the large-diameter inorganic filler 5 disposed soas to span the first resin phase 2 and the second resin phase 3. Thelarge-diameter inorganic filler 5 contacts the unevenly distributedsmall-diameter inorganic filler 4, thereby forming thermal conductionpaths 7. Therefore, the thermal conduction paths 6, which are formed ofthe small-diameter inorganic filler 4 and are adjacent to the thermalconduction paths 7 formed of the large-diameter inorganic filler 5, arethermally connected to the thermal conduction paths 7. As a result, aroute of thermal conduction is increased in an inside of the insulatingthermally conductive resin composition 1, and accordingly, it becomespossible to enhance the thermal conduction thereof.

Here, FIG. 2 shows a state of removing the large-diameter inorganicfiller from the insulating thermally conductive resin compositionaccording to this embodiment. A resin composition 11 of FIG. 2 adopts astructure in which the first resin phase 2 and the second resin phase 3are phase-separated from each other. Moreover, in the resin composition11, the small-diameter inorganic filler 4 is unevenly distributed in thefirst resin phase 2, whereby the inorganic filler is brought into mutualcontact, and forms the thermal conduction paths 6. Therefore, it is easyto form the thermal conduction paths in comparison with a case of notusing the phase-separated structure. However, if only the small-diameterinorganic filler 4 is disposed in the first resin phase 2, then a largeamount of the small-diameter inorganic filler 4 is required to enhancethe thermal conduction. Moreover, it is difficult to form the thermalconduction paths 6 completely continuously, and the thermal conductionpaths 6 are sometimes divided by the second resin phase 3, andaccordingly, the thermal conductivity is still insufficient.

In contrast, in the insulating thermally conductive resin composition 1according to this embodiment, the large-diameter inorganic filler 5 isdisposed. Then, between the thermal conduction paths 6 formed of thesmall-diameter inorganic filler 4, the second resin phase 3 is present,and the insulating thermally conductive resin composition 1 contains thelarge-diameter inorganic filler 5, whereby the thermal conduction paths7 which connect the thermal conduction paths 6 to one another is formed.Therefore, the thermal conduction in the inside of the resin compositionis performed not only in the thermal conduction paths 6 but also in thethermal conduction paths 7, and accordingly, the thermal conductivitycan be enhanced to a large extent.

Moreover, as mentioned above, it is difficult to form the thermalconduction paths 6 completely continuously by bringing all pieces of thesmall-diameter inorganic filler 4 into contact with one another in theinside of the first resin phase 2. If all pieces of the small-diameterinorganic filler 4 are attempted to be brought into contact with oneanother, then it is necessary to add a large amount of thesmall-diameter inorganic filler 4, and accordingly, viscosity of theresin composition is increased, causing an apprehension that moldabilitymay be deteriorated. In contrast, in this embodiment, not only thesmall-diameter inorganic filler 4 but also the large-diameter inorganicfiller 5 is added. Therefore, even in a case where a part of thesmall-diameter inorganic filler 4 is divided, and the thermal conductionpaths 6 do not continue with one another completely, then the thermalconduction paths 7 are formed of the large-diameter inorganic filler 5,and accordingly, the thermal conduction paths in the inside of the resincomposition are ensured, and the thermal conductivity can be enhanced.

Note that, in FIG. 1, the small-diameter inorganic filler 4 is unevenlydistributed in the first resin phase 2; however, may be unevenlydistributed in the second resin phase 3. Moreover, it is not necessarythat all pieces of the small-diameter inorganic filler 4 be disposed inthe inside of the first resin phase 2, and a part thereof may bedisposed in the second resin phase 3.

The phase-separated structure in this embodiment refers to any of asea-island structure, a continuously spherical structure, acomposite/dispersion structure and a bicontinuous structure. As shown inFIG. 3(a), the sea-island structure refers to a structure in which adispersed phase 3A with a small volume is dispersed into a continuousphase 2A, and is a structure in which the dispersed phase 3A, which isparticulate or spherical, scatters in the continuous phase 2A. As shownin FIG. 3(b), the continuously spherical structure is a structure inwhich pieces of substantially spherical dispersed phase 3 a are coupledto one another, and are dispersed into the continuous phase 2A. As shownin FIG. 3(c), the composite/dispersion structure is a structure in whichthe dispersed phase 3A scatters in the continuous phase 2A, and a resincomposing the continuous phase scatters in the dispersed phase 3A. Asshown in FIG. 3(d), the bicontinuous structure is a structure in whichthe continuous phase 2A and the dispersed phase 3A form a complicatedthree-dimensional mesh shape.

In this embodiment, it is necessary that the first resin phase 2 inwhich the small-diameter inorganic filler 4 is unevenly distributedcontinue three-dimensionally. In such a way, the small-diameterinorganic filler 4 is disposed in the inside of the first resin phase 2,whereby the thermal conduction paths 6 can be formed. Therefore, incases of the above-described sea-island structure, continuouslyspherical structure and composite/dispersion structure, it is necessarythat the continuous phase 2A be the first resin phase 2. However, in acase of the bicontinuous structure, both of the continuous phase 2A andthe dispersed phase 3A continue three-dimensionally, and accordingly,either one thereof just needs to compose the first resin phase 2.

Note that the phase-separated structure such as the sea-islandstructure, the continuously spherical structure, thecomposite/dispersion structure and the bicontinuous structure can beobtained by controlling curing conditions for the resin composition,such as a curing rate and reaction temperature, and compatibility andcompounding ratio of the resin.

As mentioned above, in this embodiment, the small-diameter inorganicfiller 4 is unevenly distributed in the first resin phase 2, and thesmall-diameter inorganic filler is brought into mutual contact, wherebythe thermal conduction paths 6 are formed. Therefore, as long as thethermal conduction paths 6 are formed, the small-diameter inorganicfiller 4 may be present with a uniform density or unevenly present inthe inside of the first resin phase 2.

Moreover, the small-diameter inorganic filler 4 may be present on aninterface between the first resin phase 2 and the second resin phase 3.That is to say, in the inside of the first resin phase 2, thesmall-diameter inorganic filler 4 may be present more in a vicinity ofthe interface between the first resin phase 2 and the second resin phase3 than in a center portion of the first resin phase 2. In this event, itis preferable that the small-diameter inorganic filler 4 be brought intocontact with the interface between the first resin phase 2 and thesecond resin phase 3. Moreover, a part of the particles which composethe small-diameter inorganic filler 4 may be disposed so as to span theinterface between the first resin phase 2 and the second resin phase 3.As described above, the small-diameter inorganic filler 4 is present onthe interface between the first resin phase and the second resin phase,whereby it becomes easy for the small-diameter inorganic filler 4 to bebrought into mutual contact in the vicinity of the interface in theinside of the first resin phase 2. Therefore, it becomes possible toform the continuous thermal conduction paths 6 in the vicinity of theinterface between the first resin phase and the second resin phase.

In this embodiment, it is preferable that the first resin phase 2 beformed of either one of a thermosetting resin and a thermoplastic resin,and that the second resin phase 3 be formed of other of thethermosetting resin and the thermoplastic resin. That is to say, in acase where the first resin phase 2 is composed of the thermosettingresin, it is preferable that the second resin phase 3 be composed of thethermoplastic resin. Moreover, in a case where the first resin phase 2is composed of the thermoplastic resin, it is preferable that the secondresin phase 3 be composed of the thermosetting resin. In such a way, itbecomes easy to form the above-described phase-separated structure.

As the thermosetting resin, there are mentioned an epoxy resin, anunsaturated polyester resin, a vinyl ester resin, a phenol resin, aurethane resin, a urea resin, a melamine resin, a maleimide resin, acyanate ester resin, an alkyd resin, an addition-curable polyimide resinand the like. As the thermosetting resin, one of these resins may beused singly, or two or more thereof may be used in combination. Amongthem, the epoxy resin is preferable since the epoxy resin is excellentin heat resistance, electric insulating properties and electricalcharacteristics.

In a case of using the epoxy resin as the thermosetting resin, apublicly known one can be used. For example, there can be used abisphenol A-type epoxy resin, a bisphenol F-type epoxy resin, abisphenol S-type epoxy resin, a biphenyl-type epoxy resin, a naphthalenediol-type epoxy resin, and a phenol novolac-type epoxy resin. Moreover,there can also be used a cresol novolac-type epoxy resin, a bisphenol Anovolac-type epoxy resin, a cycloaliphatic epoxy resin, and aheterocyclic epoxy resin (triglycidyl isocyanurate, diglycidyl hydantoinand the like). Furthermore, denatured epoxy resins obtained bydenaturing these epoxy resins by a variety of materials, and the likecan be used. Moreover, halides such as bromides and chlorides of theseepoxy resins can also be used. As the epoxy resin, one of these resinsmay be used singly, or two or more thereof may be used in combination.

As a curing agent for curing the epoxy resin, any compound can be usedas long as being a compound including an active group capable ofreacting with an epoxy group. Publicly known epoxy curing agents can beused appropriately, and particularly, compounds including an aminogroup, an acid anhydride group and a hydroxy phenyl group are suitable.For example, there are mentioned: dicyandiamide and a derivativethereof; organic acid hydrazide; amine imide; aliphatic amine; aromaticamine; tertiary amine; salt of polyamine; micro capsule-type curingagent; an imidazole-type curing agent, acid anhydride; phenol novolac;and the like. As the curing agent, one of these agents may be usedsingly, or two or more thereof may be used in combination.

Moreover, a variety of curing promotors can be used in combination withthe above-described curing agents. For example, in a case of using theepoxy resin as the thermosetting resin, then as the curing promotor,there can be mentioned: a tertiary amine-based curing promotor; a ureaderivative-based curing promotor; an imidazole-based curing promotor;and a 1,8-diazabicyclo[5.4.0]undec-7-ene (DBU)-based curing promotor.Moreover, there can be mentioned: an organic phosphor-based curingpromotor (for example, a phosphine-based curing promotor and the like);an onium salt-based curing promotor (for example, a phosphoniumsalt-based curing promotor, a sulfonium salt-based curing promotor, anammonium salt-based curing promotor and the like). Furthermore, a metalchelate-based curing promotor, acid and metal salt-based curing promotorand the like can also be mentioned.

In general, the thermoplastic resin has, in a principal chain, at leastone bond selected from the group consisting of a carbon-carbon bond, anamide bond, an imide bond, an ester bond and an ether bond. Moreover,the thermoplastic resin may have, in the principal chain, at least onebond selected from the group consisting of a carbonate bond, a urethanebond, a urea bond, a thioether bond, a sulfone bond, an imidazole bondand a carbonyl bond.

As the thermoplastic resin, for example, there are mentioned: apolyolefin-based resin; a polyamide-based resin; an elastomer-based(styrene-based, olefin-based, polyvinyl chloride (PVC)-based,urethane-based, ester-based, and amide-based) resin; an acrylic resin; apolyester-based resin; and the like. Moreover, there are mentioned:engineering plastics; polyethylene; polypropylene; a Nylon resin; anacrylonitrile-butadiene-styrene (ABS) resin; an acrylic resin; anethylene acrylate resin; an ethylene vinyl acetate resin; and apolystyrene resin. Furthermore, there are also mentioned: apolyphenylene sulfide resin; a polycarbonate resin; a polyesterelastomer resin; a polyamide elastomer resin; a liquid crystal polymer;a polybutylene terephthalate resin; and the like. As the thermoplasticresin, one of these resins may be used singly, or two or more thereofmay be used in combination.

Among them, from a viewpoint of heat resistance, the engineeringplastics such as polyether sulfone, polysulfone, polyimide and polyetherimide are preferable as the thermoplastic resin. Moreover, polyethersulfone excellent in various points such as dynamic characteristics,insulating properties, solubility to a solvent, and the like is morepreferable.

Moreover, these thermoplastic resins may have a functional group capableof reacting with the epoxy resin. As the functional group as describedabove, for example, an amino group, a hydroxyl group, chlorine atoms, analkoxy group and the like are mentioned.

In the insulating thermally conductive resin composition 1, those shownas follows are mentioned as combinations of the thermosetting resin andthe thermoplastic resin, which form the phase-separated structure. Forexample, in a case of using the epoxy resin as the thermosetting resin,then polyether sulfone and polyether imide can be used as thethermoplastic resin. Moreover, in a case of using the unsaturatedpolyester resin as the thermosetting resin, then polystyrene can be usedas the thermoplastic resin.

In the insulating thermally conductive resin composition 1, the averageparticle diameter of the small-diameter inorganic filler 4 is 0.1 μm to15 μm. By the fact that the average particle diameter of thesmall-diameter inorganic filler 4 is 0.1 μm to 15 μm, it becomes easy tounevenly distribute the small-diameter inorganic filler 4 in the firstresin phase 2 (continuous phase) in the phase-separated structure, andan insulating thermally conductive resin composition better inworkability and moldability can be obtained. That is to say, by the factthat the average particle diameter is 0.1 μm or more, the viscosity ofthe resin can be suppressed from being excessively increased, andfluidity of the resin is ensured, and accordingly, the workability andthe moldability are improved. Moreover, by the fact that the averageparticle diameter is 15 μm or less, it becomes easy to unevenlydistribute the small-diameter inorganic filler 4 in the first resinphase 2, and accordingly, the thermal conduction paths 6 can be formed,and it becomes possible to enhance the thermal conductivity. Note thatthe average particle diameter of the small-diameter inorganic filler 4is preferably 1 μm to 15 μm, more preferably 3 μm to 10 μm.

In the insulating thermally conductive resin composition 1, the averageparticle diameter of the large-diameter inorganic filler 5 is largerthan the average particle diameter of the small-diameter inorganicfiller 4. Specifically, the average particle diameter of thelarge-diameter inorganic filler 5 is 1 μm to 100 μm. By the fact thatthe average particle diameter of the large-diameter inorganic filler 5is 1 μm to 100 μm, the large-diameter inorganic filler 5 can be presentso as to span the first resin phase 2 and the second resin phase 3.Then, the thermal conduction paths 7 are formed in such a manner thatthe large-diameter inorganic filler 5 is brought into contact with theunevenly distributed small-diameter inorganic filler 4, and the thermalconduction paths can be effectively formed in the inside of theinsulating thermally conductive resin composition 1 by connecting thethermal conduction paths 6 to one another. As a result, the route of thethermal conduction is increased, and it becomes possible to enhance thethermal conduction of the insulating thermally conductive resincomposition 1. That is to say, by the fact that the average particlediameter is 1 μm or more, the large-diameter inorganic filler 5 can beeffectively brought into contact with the small-diameter inorganicfiller 4, and it becomes possible to enhance the thermal conduction.Moreover, by the fact that the average particle diameter is 100 μm orless, a molding appearance of the insulating thermally conductive resincomposition 1 can be suppressed from decreasing. Note that the averageparticle diameter of the large-diameter inorganic filler 5 is preferably20 μm to 100 μm, more preferably 20 μm to 90 μm.

As mentioned above, the average particle diameter of the small-diameterinorganic filler 4 is 0.1 μm to 15 μm, and the average particle diameterof the large-diameter inorganic filler 5 is 1 μm to 100 μm. However, itis necessary that the large-diameter inorganic filler 5 have a particlediameter sufficient for allowing the large-diameter inorganic filler 5to span the first resin phase 2 and the second resin phase 3, andfurther, for mutually and thermally connecting the small-diameterinorganic filler 4 unevenly distributed in the first resin phase 2.Therefore, the average particle diameter of the large-diameter inorganicfiller 5 is preferably twice or more the average particle diameter ofthe small-diameter inorganic filler 4, more preferably, three times ormore the same. In such a way, the thermal conduction paths 6 composed ofthe small-diameter inorganic filler 4 are thermally connected to oneanother, and it becomes possible to further enhance the thermalconductivity of the whole of the insulating thermally conductive resincomposition 1.

Note that, in this description, the “average particle diameter” standsfor a median diameter. Moreover, the median diameter stands for aparticle diameter (d50) in which an integrated (accumulated) weightpercent becomes 50%. For example, the median diameter can be measured byusing the laser diffraction-type particle size distribution measuringinstrument “SALD2000” (made by Shimadzu Corporation). Note that theaverage particle diameters of the small-diameter inorganic filler 4 andthe large-diameter inorganic filler 5, which are included in the insideof the insulating thermally conductive resin composition 1, can bemeasured by firing the insulating thermally conductive resin composition1 and isolating the small-diameter inorganic filler 4 and thelarge-diameter inorganic filler 5 from each other.

In this embodiment, it is preferable that a ratio of a sum of thesmall-diameter inorganic filler 4 and the large-diameter inorganicfiller 5 in the insulating thermally conductive resin composition 1(that is, the ratio is [total volume of small-diameter inorganic fillerand large-diameter inorganic filler]/[volume of insulating thermallyconductive resin composition]) be 10 to 80% by volume. By the fact thatthe volume ratio of the sum of the small-diameter inorganic filler 4 andthe large-diameter inorganic filler 5 is 10% by volume or more, aneffect of the enhancement of the thermal conduction, which is brought bythe contact between the small-diameter inorganic filler 4 and thelarge-diameter inorganic filler 5, can be fully expected. Moreover, bythe fact that the volume ratio of the sum of the small-diameterinorganic filler 4 and the large-diameter inorganic filler 5 is 80% byvolume or less, no difficulty occurs in forming the thermal conductionpaths 6 by the small-diameter inorganic filler 4, and further, theviscosity of the resin can be suppressed from being excessivelyincreased by at the time of molding. Note that the volume ratio can bemeasured by a method to be described later.

Moreover, the ratio of the small-diameter inorganic filler 4 and thelarge-diameter inorganic filler 5 in the insulating thermally conductiveresin composition 1 is more preferably 15 to 80% by volume, still morepreferably 20 to 80% by volume, particularly preferably 30 to 70% byvolume, most preferably 30 to 60% by volume. By setting the ratio withinsuch a range as described above, it becomes possible to strike a balancebetween the high thermal conductivity and the moldability.

In the insulating thermally conductive resin composition 1, it ispreferable that a ratio of the large-diameter inorganic filler 5 in thesum of the small-diameter inorganic filler 4 and the large-diameterinorganic filler 5 (that is, the ratio is [volume of large-diameterinorganic filler]/[total volume of small-diameter inorganic filler andlarge-diameter inorganic filler]) be 5 to 60% by volume. By the factthat the volume ratio of the large-diameter inorganic filler 5 is 5% byvolume or more, it becomes possible to enhance the thermal conduction,which is brought by the contact thereof with the small-diameterinorganic filler 4. Moreover, by the fact that the volume ratio of thelarge-diameter inorganic filler 5 is 60% by volume or less, it becomespossible to form the thermal conduction paths 6 by the small-diameterinorganic filler 4. Note that it is more preferable that the ratio ofthe large-diameter inorganic filler 5 in the sum of the small-diameterinorganic filler 4 and the large-diameter inorganic filler 5 be 20 to50% by volume.

Here, the insulating thermally conductive resin composition 1 of thisembodiment can provide a resin composition, which has electricinsulating properties, by using a material exhibiting the electricinsulating properties. Then, in the insulating thermally conductiveresin composition 1, it is preferable to use an inorganic compound,which combines the thermal conductivity and the electric insulatingproperties with each other, as a constituent material of thesmall-diameter inorganic filler 4 and the large-diameter inorganicfiller 5.

As the inorganic compound provided with the thermal conductivity, forexample, an inorganic compound with a thermal conductivity of 1 W/m·K ormore can be used. Note that thermal conductivity of the inorganiccompound provided with the thermal conduction is preferably 10 W/m·K ormore, more preferable 30 W/m·K or more. Moreover, as an inorganiccompound provided with the electric insulating properties, an inorganiccompound in which a volume resistivity at room temperature (25° C.) is10 Ω·cm or more can be used. Note that the volume resistivity of theinorganic compound provided with the electric insulating properties ispreferably 10⁵ Ω·cm or more, more preferably 10⁸ Ω·cm or more,particularly preferably 10¹³ Ω·cm or more.

As the inorganic compound that combines the thermal conductivity and theelectric insulating properties with each other, for example, there canbe mentioned boride, carbide, nitride, oxide, silicide, hydroxide,carbonate and the like. Specifically, for example, there are mentionedmagnesium oxide (MgO), aluminum oxide (Al₂O₃), boron nitride (BN),aluminum nitride (AlN), aluminum hydroxide (Al(OH)₃) and the like.Moreover, there are also mentioned silicon dioxide (SiO₂), magnesiumcarbonate (MgCO₃), magnesium hydroxide (Mg(OH)₂), calcium carbonate(CaCO₃), clay, talc, mica, titanium oxide (TiO₂), zinc oxide (ZnO) andthe like. From viewpoints of the thermal conductivity and easiness offilling, it is preferable that the small-diameter inorganic filler 4 andthe large-diameter inorganic filler 5 contain at least one selected fromthe group consisting of MgO, Al₂O₃, BN and AlN. Moreover, it isparticularly preferable that the small-diameter inorganic filler 4 andthe large-diameter inorganic filler 5 contain at least one of MgO, Al₂O₃and BN.

In order to enhance the compatibility with the resin, dispersibility ofthe small-diameter inorganic filler 4 and the large-diameter inorganicfiller 5 into the insulating thermally conductive resin composition 1may be enhanced by performing surface treatment such as couplingtreatment for the small-diameter inorganic filler 4 and thelarge-diameter inorganic filler 5, adding a dispersant thereto, and soon. Moreover, by appropriately selecting a surface treatment agent, thesmall-diameter inorganic filler 4 can be unevenly distributed moreeffectively in the phase-separated structure.

For the surface treatment, an organic surface treatment agent such asfatty acid, fatty acid ester, higher alcohol and hydrogenated oil can beused. Moreover, for the surface treatment, an inorganic surfacetreatment agent such as silicone oil, a silane coupling agent, analkoxysilane compound and a silylation agent can also be used. By usingthese surface treatment agents, water resistance of the insulatingthermally conductive resin composition 1 is sometimes enhanced, andfurther, the dispersibility thereof into the resin is sometimesenhanced. A treatment method is not particularly limited; however, thereare (1) a dry method, (2) a wet method, (3) an integral blending methodand the like.

(1) Dry Method

The dry method is a method of performing the surface treatment bydropping the surface treatment agent onto the small-diameter inorganicfiller and the large-diameter inorganic filler while stirring thesmall-diameter inorganic filler and the large-diameter inorganic fillerby mechanical stirring using the Henschel mixer, the nauta mixer, thevibration mill and the like. In a case of using silane as the surfacetreatment agent, there can be used: a solution obtained by dilutingsilane with an alcohol solvent; a solution obtained by diluting silanewith the alcohol solvent and further adding water thereto; a solutionobtained by diluting silane with the alcohol solvent and further addingwater and acid thereto; and the like. A preparation method of thesurface treatment agent is written on a catalog and the like of eachmaker of the silane coupling agent; however, the preparation method isappropriately determined depending on a hydrolysis rate of silane and atype of the inorganic filler.

(2) Wet Method

The wet method is a method of immersing the small-diameter inorganicfiller and the large-diameter inorganic filler directly into the surfacetreatment agent. A usable surface treatment agent is similar to theabove-described drying method. Moreover, a preparation method of thesurface treatment agent is also similar to that in the dry method.

(3) Integral Blending Method

The integral blending method is a method of, at a time of mixing a resinand filler with each other, directly adding the surface treatment agentas it is into a mixer or after diluting the same surface treatment agentwith alcohol and the like, followed by stirring. A preparation method ofthe surface treatment agent is similar to those of the dry method andthe wet method; however, it is general to increase an amount of thesurface treatment agent in a case of performing the surface treatment bythe integral blending method in comparison with those of the dry methodand the wet method.

In the dry method and the wet method, the surface treatment agent isdried according to needs. In a case of adding such a surface treatmentagent using alcohol and the like, it is necessary to volatilize alcohol.If alcohol remains finally in a blended compound, then alcohol isgenerated as gas, and adversely affects a polymer content. Hence, it ispreferable to set a drying temperature at a boiling point of a usedsolvent or more. Moreover, in the case of using silane as the surfacetreatment agent, then it is preferable to heat such a blended compoundto a high temperature (for example, 100° C. to 150° C.) by using adevice in order to rapidly remove silane that has not reacted with theinorganic filler. However, it is preferable to maintain the blendedcompound at a temperature lower than the decomposition point of silanealso in consideration of heat resistance of silane. It is preferablethat a treatment temperature approximately range from 80 to 150° C., andthat a treatment time range from 0.5 to 4 hours. The drying temperatureand the time are appropriately selected depending on a throughput,whereby it becomes possible to remove the solvent and the unreactedsilane.

In the case of using silane as the surface treatment agent, an amount ofsilane, which is required to treat the surface of the inorganic filler,can be calculated by the following expression.[Amount of silane (g)]=[amount of inorganic filler (g)]×[specificsurface area of inorganic filler (m²/g)]/[minimum coating area of silane(m²/g)]

The “minimum coating area of silane” can be obtained by the followingcalculation expression.[Minimum coating area of silane (m²/g)]=(6.02×10²³)×(13×10⁻²⁰(m²))/[molecular weight of silane]

In the expression, “6.02×10²³” is the Avogadro constant, and “13×10⁻²⁰”is an area (0.13 nm²) covered by one-molecule silane.

It is preferable that the required amount of silane be 0.5 time or moreto less than 1.0 time the amount of silane, which is calculated by thiscalculation expression. Even if the amount of silane is 1.0 time ormore, the effects of the present invention can be exerted. However, insuch a case where the amount of silane is 1.0 time or more, an unreactedcontent remains, causing an apprehension that a decrease of mechanicalproperties and a decrease of physical properties, such as a decrease ofwater resistance, may be brought about, and accordingly, it ispreferable that an upper limit of the required amount of silane be lessthan 1.0 time. Moreover, a reason why a lower limit value of therequired amount of silane is set at 0.5 time the amount of silane, whichis calculated by the above-described calculation expression, is thatthis lower limit value is sufficient for effectively enhancing a fillingcapability of the filler into the resin.

As long as the effects of the present invention are not inhibited, acolorant, a flame retarder, a flame-retardant assistant, a fiberreinforcement, a viscosity reducer for viscosity adjustment during theproduction, a dispersion adjuster for enhancing dispersibility of toner(colorant), a mold release agent and the like may be contained in theinsulating thermally conductive resin composition 1. Those known inpublic can be used as these; however, those shown as below can bementioned.

As the colorant, for example, there can be used inorganic pigment suchas titanium oxide, organic pigment, or toner containing these as maincomponents. One of these colorants may be used singly, or two or morethereof may be used in combination.

As the flame retarder, an organic flame retarder, an inorganic flameretarder, a reactive flame retarder and the like are mentioned. One ofthese flame retarders may be used singly, or two or more thereof may beused in combination. Note that, in a case of allowing the flame retarderto be contained in the insulating thermally conductive resin composition1, it is preferable to use the flame-retardant assistant in combination.As the flame-retardant assistant, there are mentioned: an antimonycompound such as diantimony trioxide, diantimony tetraoxide, diantimonypentoxide, sodium antimonate, antimony tartrate; zinc borate; bariummetaborate; and the like. Moreover, hydrated alumina, zirconium oxide,ammonium polyphosphate, tin oxide, iron oxide and the like are alsomentioned. One of these flame-retardant assistants may be used singly,or two or more thereof may be used in combination.

It is preferable that the thermal conductivity of the insulatingthermally conductive resin composition 1 of this embodiment be 3 W/m·Kor more. Even if the thermal conductivity is less than 3 W/m·K, theeffects of the present invention can be exerted. However, by the factthat the thermal conductivity is 3 W/m·K or more, an electroniccomponent can be cooled efficiently even if being miniaturized in a caseof using the insulating thermally conductive resin composition 1 as aradiator of the electronic component.

Next, a description is made of a production method of the insulatingthermally conductive resin composition of this embodiment. First, thethermosetting resin composing the first resin, the thermoplastic resincomposing the second resin, the inorganic filler and the curing agentare added to and kneaded with one another, and a resin composition in anuncured state is produced. Such kneading of the respective componentsmay be performed in one step, or may be performed in a plurality ofsteps by sequentially adding the respective components. In a case ofsequentially adding the respective components, the respective componentscan be added in an arbitrary order.

As a kneading and adding method of the respective components, forexample, a part or whole quantity of the thermoplastic resin is firstkneaded with the thermosetting resin, and viscosity of a resultantmixture is adjusted. Next, the mixture is kneaded while sequentiallyadding thereto the rest, which is the thermoplastic resin, the inorganicfiller and the curing agent. An order of such addition is notparticularly limited; however, it is preferable to add the curing agentlast from a viewpoint of storage stability of the resin composition.

As mentioned above, additives such as the colorant, the flame retarder,the flame-retardant assistant, the fiber reinforcement, the viscosityreducer, the dispersion adjuster and the mold release agent may be addedto the resin composition according to needs. Moreover, the order ofadding these additives is not particularly limited, either, and theadditives can be added in arbitrary steps; however, it is preferable toadd the curing agent last as mentioned above.

As a kneading machine device for use in producing the resin composition,those heretofore known in public can be used. Specifically, there can bementioned a roll mill, a planetary mixer, a kneader, an extruder, aBanbury mixer, a mixing vessel provided with an impeller, a lateral-typemixing tank and the like.

A kneading temperature in an event of producing the resin composition isnot particularly limited; however, preferably, ranges from 10 to 150° C.When the kneading temperature exceeds 150° C., then in some case, apartial curing reaction starts, and the storage stability of theobtained resin composition decreases. When the kneading temperature islower than 10° C., then the viscosity of the resin composition is high,and it becomes substantially difficult to knead the resin composition insome case. The kneading temperature preferably ranges from 20 to 120°C., more preferably 30 to 100° C.

An arbitrary method is possible as a molding method of the uncured resincomposition, and an arbitrary shape is possible as the molded shape. Forexample, as molding means, there can be used a variety of means such ascompression molding (direct pressure molding), transfer molding,injection molding, extrusion molding, and screen printing.

The insulating thermally conductive resin composition according to thisembodiment includes the phase-separated structure including: the firstresin phase 2 in which the first resin continues three-dimensionally;and the second resin phase 3, which is different from the first resinphase 2 and is formed of the second resin. Moreover, the insulatingthermally conductive resin composition includes: the small-diameterinorganic filler 4, which is unevenly distributed in the first resinphase 2; and the large-diameter inorganic filler 5, which spans thefirst resin phase 2 and the second resin phase 3, and thermally connectsthe pieces of the small-diameter inorganic filler 4, which is unevenlydistributed in the first resin phase 2, to one another. Then, theaverage particle diameter of the small-diameter inorganic filler 4 is0.1 to 15 μm. Moreover, the average particle diameter of thelarge-diameter inorganic filler 5 is larger than the average particlediameter of the small-diameter inorganic filler 4, and is 1 to 100 μm.With such a configuration, the large-diameter inorganic filler thermallyconnects the thermal conduction paths, which are composed of thesmall-diameter inorganic filler, to one another, and accordingly, thethermal conduction paths are formed more effectively. As a result, thethermal conduction routes in the resin composition are increased, andaccordingly, the thermal conductivity is enhanced though the fillingamount of the thermally conductive inorganic filler is small.Furthermore, by the fact that the filling amount of the thermallyconductive inorganic filler is small, the fluidity of the insulatingthermally conductive resin composition is ensured, and accordingly, themoldability is enhanced, and the workability is improved. Moreover, asmentioned above, the insulating thermally conductive resin compositionof this embodiment is composed of the materials having the electricinsulating properties, and accordingly, the whole of the resincomposition can be provided with high electric insulating properties.

EXAMPLES

A description is made below of the present invention in more detail byexamples and comparative examples; however, the present invention is notlimited to these examples.

In an event of producing resin compositions of the examples and thecomparative examples, resins, a curing agent and inorganic fillers,which are described below, were used.

(Thermosetting Resin)

Epoxy resin (“jER (registered trademark) 828” made by MitsubishiChemical Corporation, epoxy equivalent weight: 189 g/eq, hereinafter,also referred to as DGEBA (bisphenol A diglycidyl ether)

(Thermoplastic Resin)

Polyether sulfone (“SUMIKAEXCEL (registered trademark) 5003P” made bySumitomo Chemical Company, Limited, hereinafter, also referred to asPES)

(Curing Agent)

4,4′-methylenedianiline (made by Wako Pure Chemical Industries, Ltd.,active hydrogen equivalent weight: 49.5 g/eq, hereinafter, also referredto as MDA)

(Inorganic Filler)

Small-diameter inorganic filler A: MgO, average particle diameter (d50):8 μm

Small-diameter inorganic filler B: BN, average particle diameter (d50):8 μm

Small-diameter inorganic filler C: Al₂O₃, average particle diameter(d50): 5 μm

Small-diameter inorganic filler D: Al(OH)₃, average particle diameter(d50): 8 μm

Small-diameter inorganic filler E: Al₂O₃, average particle diameter(d50): 1.2 μm

Small-diameter inorganic filler F: Al₂O₃, average particle diameter(d50): 0.6 μm

Large-diameter inorganic filler A: MgO, average particle diameter (d50):25 μm

Large-diameter inorganic filler B: MgO, average particle diameter (d50):80 μm

Large-diameter inorganic filler C: Al(OH)₃, average particle diameter(d50): 35 μm

Large-diameter inorganic filler D: Al₂O₃, average particle diameter(d50): 10 μm

Large-diameter inorganic filler E: Al₂O₃, average particle diameter(d50): 3 μm

Example 1

22.3 parts by mass of PES pulverized so that an average particlediameter thereof could be 10 μm were added to 100 parts by mass ofDGEBA. Moreover, this mixture was stirred in an oil bath warmed up to120° C., whereby PES was completely dissolved into DGEBA, and an epoxyresin solution was obtained.

Next, by using a roll mill set at 80° C., 70 parts by mass of thesmall-diameter inorganic filler A and 10 parts by mass of thelarge-diameter inorganic filler A were kneaded with the above-mentionedepoxy resin solution. Moreover, 26 parts by mass of MDA were kneadedwith the kneaded epoxy resin solution. Thereafter, a kneaded mixturethus obtained was put into a vacuum dryer set at 120° C., and wassubjected to vacuum degassing for 5 minutes, whereby a resin compositionwas obtained.

This resin composition was put into a die warmed up to 150° C., was heldat 150° C. in a drying oven for 2 hours, and further, was heated at 180°C. for 2 hours, whereby a test piece of this example was obtained.

Examples 2, 6 and 7 and Comparative Examples 1, 2, 5 and 6

Test pieces of the respective examples were obtained in a similar way toExample 1 except that the small-diameter inorganic filler, thelarge-diameter inorganic filler and the blending amounts of these werechanged as those shown in Table 1.

Example 3

22.3 parts by mass of PES pulverized so that an average particlediameter thereof could be 10 μm were added to 100 parts by mass ofDGEBA. Next, this mixture was stirred in an oil bath warmed up to 120°C., whereby PES was completely dissolved into DGEBA, and an epoxy resinsolution was obtained.

Next, by using a roll mill set at 120° C., 300 parts by mass of thesmall-diameter inorganic filler C, 75 parts by mass of thelarge-diameter inorganic filler A and 75 parts by mass of thelarge-diameter inorganic filler C were kneaded with the above-mentionedepoxy resin solution. Thereafter, a kneaded mixture was slowly cooleddown to 80° C. Moreover, by using a roll mill set at 80° C., 26 parts bymass of MDA were kneaded with the kneaded mixture thus cooled downslowly, whereby a resin composition was obtained.

This resin composition was put into top and bottom dies set at 150° C.,and was pressed with a molding pressure of 1 MPa at a die temperature of150° C. for 2 hours. Thereafter, such a cured product thus pressed wastaken out of the dies, and was heated at 180° C. in a drying oven for 2hours, whereby a test piece of this example was obtained.

Examples 4 and 5, Comparative Examples 3 and 4

Test pieces of the respective examples were obtained in a similar way toExample 3 except that the small-diameter inorganic filler, thelarge-diameter inorganic filler and the blending amounts of these werechanged as those shown in Table 1.

TABLE 1 Example Example Example Example Example Example ExampleComparative Comparative Comparative Comparative Comparative Comparative1 2 3 4 5 6 7 Example 1 Example 2 Example 3 Example 4 Example 5 Example6 Blending Thermosetting DGEBA 100 100 100 100 100 100 100 100 100 100100 100 100 amounts resin (parts by Thermoplastic PES 22.3 22.3 22.322.3 22.3 22.3 22.3 22.3 22.3 22.3 22.3 22.3 22.3 mass) resin Curingagent MDA 26 26 26 26 26 26 26 26 26 26 26 26 26 InorganicSmall-diameter 70 0 0 0 0 0 0 80 50 75 400 0 0 filler inorganic filler A(MgO, d50: 8 μm) Small-diameter 0 110 0 0 0 0 0 0 110 0 0 0 0 inorganicfiller B (BN, d50: 8 μm) Small-diameter 0 0 300 500 300 0 0 0 0 300 5000 0 inorganic filler C (Al₂O₃, d50: 5 μm) Small-diameter 0 0 0 0 0 0 0 00 75 0 0 0 inorganic filler D (Al(OH)₃, d50: 8 μm) Small-diameter 0 0 00 0 105 0 0 0 0 0 210 0 inorganic filler E (Al₂O₃, d50: 1.2 μm)Small-diameter 0 0 0 0 0 0 85 0 0 0 0 0 90 inorganic filler F (Al₂O₃,d50: 0.6 μm) Large-diameter 10 0 75 0 0 0 0 0 0 0 0 0 0 inorganic fillerA (MgO, d50: 25 μm) Large-diameter 0 50 0 400 600 0 0 0 0 0 0 0 0inorganic filler B (MgO, d50: 80 μm) Large-diameter 0 0 75 0 0 0 0 0 0 00 0 0 inorganic filler C (Al(OH)₃, d50: 35 μm) Large-diameter 0 0 0 0 0105 0 0 0 0 0 0 0 inorganic filler D (Al₂O₃, d50: 10 μm) Large-diameter0 0 0 0 0 0 5 0 0 0 0 0 0 inorganic filler E (Al₂O₃, d50: 3 μm)

Volume ratios of the inorganic fillers, thermal conductivities andmoldabilities in the respective test pieces of the examples and thecomparative examples were measured/evaluated by the following method.Measurement/evaluation results are shown in Table 2.

[Volume Ratio of Inorganic Filler]

First, a volume of the test piece in each of the examples was calculatedby the Archimedean method. Next, each of the test pieces was fired at625° C. by using a muffle furnace, and a weight of an ash content wasmeasured. Then, since the ash content is the inorganic fillers, a totalvolume ratio of the small-diameter and large-diameter inorganic fillersand a volume ratio of the large-diameter inorganic filler in the testpiece were measured based on compounding ratios and densities of thesmall-diameter and large-diameter inorganic fillers, the weight of theash content and the volume of the test piece. Note that the densitieswere defined as: 3.65 g/cm³ for MgO, 2.27 g/cm³ for BN, 3.9 g/cm³ forAl₂O₃, and 2.42 g/cm³ for Al(OH)₃. Moreover, the density of Al(OH)₃ wascalculated also in consideration of dehydration.

[Thermal Conductivity]

The thermal conductivity of each of the examples was obtained from aproduct of a thermal diffusivity, a specific heat and the density. Inthis event, the thermal diffusivity was measured by the Xe flashanalyzer LFA447 Nanoflash made by NETZSCH GmbH, and the specific gravityand the specific heat were measured by the Archimedean method (waterdisplacement method). Moreover, the specific heat was measured by theDSC method by using DSC6220 made by Seiko Instruments Inc.

[Moldability]

Such molding processability was determined by the following criteriabased on a molded situation of a plate-like test piece in an event ofputting the resin composition in each of the examples and thecomparative examples into a die with a length and breadth of 100 mm anda thickness of 2.0 mm. Note that such a determination was performed byvisually observing the test piece or observing a cross section thereofby a scanning electron microscope (SEM).

◯(good): The plate-like test piece was able to be molded with no moldingdefect being observed.

x (failure): The molding resulted in being short shot, and the testpiece was not able to be molded. Alternatively, a molding defect such asa void was observed.

TABLE 2 Example Example Example Example Example Example Example 1 2 3 45 6 7 Total volume ratio 15 33 51 66 66 30 15 of small-diameter andlarge-diameter inorganic fillers (% by volume) Volume ratio of 12 22 4046 68 50 5 large diameter inorganic filler (% by volume) Thermal 0.7 3.95.2 10.2 6.8 1.3 0.4 conductivity of resin composition (W/mK)Moldability ∘ ∘ ∘ ∘ ∘ ∘ ∘ Comparative Comparative ComparativeComparative Comparative Comparative Example 1 Example 2 Example 3Example 4 Example 5 Example 6 Total volume ratio 15 35 51 66 30 15 ofsmall-diameter and large-diameter inorganic fillers (% by volume) Volumeratio of 0 0 0 0 0 0 large diameter inorganic filler (% by volume)Thermal 0.4 1.8 3.1 6.6 0.7 0.2 conductivity of resin composition (W/mK)Moldability ∘ ∘ ∘ x ∘ ∘

From Table 2, in comparison with Comparative examples 1 to 6, Examples 1to 7 exhibited high thermal conductivities though the volume ratios ofthe individual inorganic fillers were the same.

Here, a reason why the thermal conductivity in Example 5 became lowerthan the thermal conductivity in Example 4 is conceived to be that,since the volume ratio of the large-diameter inorganic filler was large,the thermal conduction paths of the small-diameter inorganic filler bythe phase separation were not formed sufficiently, and the formation ofthe phase-separated structure was adversely affected. However, when itis considered that the test piece was not able to be molded since theviscosity was increased in Comparative example 4 in which the volumeratio of the inorganic fillers was the same, it is understood thatExample 5 is also useful.

Moreover, FIG. 4 shows a result of observing a cross section of theinsulating thermally conductive resin composition of Example 6 by thescanning electron microscope. As shown in FIG. 4, it is understood thatthe small-diameter inorganic filler 4 is unevenly distributed in thefirst resin phase 2, and further, that the large-diameter inorganicfiller 5 spans the first resin phase 2 and the second resin phase 3.Then, it can be confirmed that the large-diameter inorganic filler 5 isbrought into contact with and thermally connected to the thermalconduction paths composed of the small-diameter inorganic filler 4.

FIG. 5 shows a result of observing a cross section of the insulatingthermally conductive resin composition of Example 7 by the scanningelectron microscope. As shown in FIG. 5, it is understood that, inExample 7, the small-diameter inorganic filler 4 is present on theinterface between the first resin phase 2 and the second resin phase 3.Moreover, it is understood that the small-diameter inorganic filler 4 ispresent more on the interface between the first resin phase 2 and thesecond resin phase 3 than in a center portion of the first resin phase2. In particular, the small-diameter inorganic filler 4 is disposed soas to be brought into contact with the interface between the first resinphase 2 and the second resin phase 3, and as a result, it can beconfirmed that the continuous thermal conduction paths 6 are formed.

Note that, in Example 7, the first resin phase is formed of polyethersulfone, and further, polyether sulfone contains sulfur. Therefore, in acase where the obtained resin composition is observed by the scanningelectron microscope, the first resin phase containing sulfur turns togray in comparison with the second resin phase. Hence, the first resinphase, the second resin phase and the interface therebetween can bedetermined by such a scanning electron microscope picture.

The entire content of Japanese Patent Application No. P2013-068846(filed on Mar. 28, 2013) is herein incorporated by reference.

Although the present invention has been described above by reference tothe embodiments and the example, the present invention is not limited tothose, and it will be apparent to these skilled in the art that variousmodifications and improvements can be made.

INDUSTRIAL APPLICABILITY

In the insulating thermally conductive resin composition of the presentinvention, the small-diameter inorganic filler is unevenly distributedin the first resin phase, and further, the large-diameter inorganicfiller, which spans the first resin phase and the second resin phase, ispresent. Therefore, a plurality of the thermal conduction paths composedof the small-diameter inorganic filler are thermally connected to oneanother by the large-diameter inorganic filler, and accordingly, a largenumber of the thermal conduction paths are generated. As a result, thethermal conductivity is enhanced though the filling amount of thethermally conductive inorganic filler is small. Furthermore, by the factthat the filling amount of the thermally conductive inorganic filler issmall, the fluidity of the resin composition is ensured, andaccordingly, the moldability is enhanced, whereby the workability isimproved.

REFERENCE SIGNS LIST

-   -   1 INSULATING THERMALLY CONDUCTIVE RESIN COMPOSITION    -   2 FIRST RESIN PHASE    -   3 SECOND RESIN PHASE    -   4 SMALL-DIAMETER INORGANIC FILLER    -   5 LARGE-DIAMETER INORGANIC FILLER

The invention claimed is:
 1. An insulating thermally conductive resincomposition, comprising: a phase-separated structure including: a firstresin phase in which a thermoplastic resin continuesthree-dimensionally; and a second resin phase different from the firstresin phase and formed of a thermosetting resin; small-diameterinorganic filler unevenly distributed in the first resin phase; andlarge-diameter inorganic filler that spans the first resin phase and thesecond resin phase and thermally connects pieces of the small-diameterinorganic filler to one another, the small-diameter inorganic fillerbeing unevenly distributed in the first resin phase, wherein an averageparticle diameter of the small-diameter inorganic filler is 0.1 to 15μm, and an average particle diameter of the large-diameter inorganicfiller is twice or more the average particle diameter of thesmall-diameter inorganic filler, and is 1 to 100 μm, and wherein, in thefirst resin phase, thermal conduction paths are formed by bringing thepieces of the small-diameter inorganic filler in contact with oneanother.
 2. The insulating thermally conductive resin compositionaccording to claim 1, wherein the small-diameter inorganic filler ispresent on an interface between the first resin phase and the secondresin phase.
 3. The insulating thermally conductive resin compositionaccording to claim 1, wherein the small-diameter inorganic filler isbrought into contact with an interface between the first resin phase andthe second resin phase, or spans the interface.
 4. The insulatingthermally conductive resin composition according to claim 1, wherein anamount of a sum of the small-diameter inorganic filler and thelarge-diameter inorganic filler in the insulating thermally conductiveresin composition is 10 to 80% by volume, and an amount of thelarge-diameter inorganic filler in the sum of the small-diameterinorganic filler and the large-diameter inorganic filler is 5 to 60% byvolume.
 5. The insulating thermally conductive resin compositionaccording to claim 1, wherein the small-diameter inorganic filler andthe large-diameter inorganic filler contain at least one selected fromthe group consisting of MgO, Al₂O₃, BN and AlN.
 6. The insulatingthermally conductive resin composition according to claim 1, wherein thethermosetting resin is an epoxy resin, and the thermoplastic resin ispolyether sulfone.
 7. The insulating thermally conductive resincomposition according to claim 6, wherein the phase-separated structureis a bicontinuous structure, the small-diameter inorganic filler and thelarge-diameter inorganic filler contain at least one of MgO, Al₂O₃ andBN, an amount of a sum of the small-diameter inorganic filler and thelarge-diameter inorganic filler in the insulating thermally conductiveresin composition is 20 to 80% by volume, and thermal conductivity ofthe insulating thermally conductive resin composition is 3 W/m·K ormore.